Accordingly, this Special Issue aims to present research papers, communications, and review articles focusing on heterogeneous multi-dimensional fusion integration, optoelectronic fusion collaborative simulation analysis, high-quality optoelectronic chip. Accordingly, this Special Issue aims to present research papers, communications, and review articles focusing on heterogeneous multi-dimensional fusion integration, optoelectronic fusion collaborative simulation analysis, high-quality optoelectronic chip. Integrating microelectronics and optoelectronics can harness the mature processes and functions of microelectronics, with the ultra-wideband and low-power benefits of optoelectronics. This integration addresses challenges like high-speed, low-power consumption and intelligence, driving the. Yunfeng Wen and Fang Yang are with the Department of Electronic Engineering, Tsinghua University, Beijing 100084, P. China (e-mail:. In the ever-evolving domain of optoelectronics, the longstanding reliance on bulk three-dimensional semiconductors—such as silicon, germanium, and III-V compounds—is confronting fundamental physical constraints. These classical materials, which have underpinned solar cells and high-speed.